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8003
PCB, Pad-per-hole, Epoxy Glass Composite, 1.57mm, 114.3mm x 165.1mm
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 6 week(s)
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | €25.720 |
Price for:Each
Minimum: 1
Multiple: 1
€25.72 (ex VAT)
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Product Information
ManufacturerVECTOR ELECTRONICS
Manufacturer Part No8003
Order Code2850706
Technical Datasheet
Board Type0
Board MaterialEpoxy Glass Composite
Hole Diameter1.067mm
External Height114.3mm
External Width165mm
Board Thickness1.57mm
Product Overview
The 8003 is a PCB Pad-per-hole and Ground Plane Prototyping Board, 0.085-inch square solder pad etched around each hole on wiring side. Accommodates any type DIP IC device or discrete component. Single sided board with pads and peripheral GND plane on one side only. No etch or plating on reverse side. Made of CEM-1. T42-1 solder terminals, R32 wire-wrap socket pin.
- T44, T46, T49, T68 Wire wrap terminals
- UL94V-0 Flammability rating
- NEMA grade material
Applications
Industrial
Technical Specifications
Board Type
0
Hole Diameter
1.067mm
External Width
165mm
Board Material
Epoxy Glass Composite
External Height
114.3mm
Board Thickness
1.57mm
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:85340019
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Y-Ex
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.05