BGA-STD-015
Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | €2.970 |
| 10+ | €2.260 |
| 25+ | €1.820 |
| 50+ | €1.710 |
| 100+ | €1.680 |
Product Information
Product Overview
The BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized, thermal tape, 26.5°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Applications
HVAC
Technical Specifications
26.5°C/W
14mm
14mm
Aluminium
0.39"
-
BGA
10mm
-
0.55"
0.55"
-
Technical Docs (1)
Associated Products
4 Products Found
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Great Britain
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate