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| Menge | Preis (ohne MwSt.) |
|---|---|
| 1+ | 122,480 € |
Produktspezifikationen
Produktbeschreibung
DA14535-00FXDEVKT-P is a SmartBond TINY DA14535 Bluetooth Low Energy 5.3 SoC development kit Pro for the DA14535 SmartBond TINY™ SoC includes a motherboard, daughterboard, and cables. This kit is primarily intended for software application development and power measurements. This kit offers users the capability for software development, programming DA14535 via JTAG or UART using the DA14535 SDK, RF characterization, hardware prototyping, PMM2 (power measurement, 2x auxiliary voltage/current measurement, monitoring 8x digital inputs (0.9V -5V)), connecting MikroBUS™ modules. The DA14535 is an ultra-low power Bluetooth 5.3 SoC with an Arm® Cortex® M0+, 64kB of RAM, and 12kB of OTP that is specified for operation at 105°C. The DA14535 is an enhanced version of the DA14531. Suitable for medical applications, disposables, Beacons, proximity tags and trackers, wireless sensor nodes, smartwatches, human interface devices, toys and industrial applications.
- Easily attached/detached daughterboards
- Integrated power measurement module
- Can be powered from a USB power bank
- DCDC buck or LDO mode operation
- MikroBUS and Pmod™ headers
- SEGGER J-Link debugger
Lieferumfang
Motherboard, SoC daughterboard, USB cable, and Quick Start Guide.
Technische Spezifikationen
Renesas
Wireless-Konnektivität
Pro-Hauptplatine & Pro-Tochterplatine DA14535-00000FX2
No SVHC (25-Jun-2025)
DA14535-00000FX2
Bluetooth Low Energy, SoC
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Technische Dokumente (1)
Gesetzgebung und Umweltschutz
Land, in dem der letzte Fertigungsprozeß ausgeführt wurde.Herkunftsland:Germany
Land, in dem der letzte Fertigungsprozeß ausgeführt wurde.
RoHS
RoHS
Produkt-Konformitätszertifikat