BGA-STD-050
Heat Sink, For Ball Grid Array, Standard, 14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | €3.740 |
| 10+ | €2.580 |
| 25+ | €2.410 |
| 50+ | €2.270 |
| 100+ | €1.860 |
Product Information
Product Overview
The BGA-STD-050 is a 20mm standard Heat Sink with aluminium, black anodized, thermal tape, 14°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Applications
HVAC
Technical Specifications
14°C/W
20mm
20mm
Aluminium
0.752"
-
No SVHC (17-Jan-2023)
BGA
19.1mm
-
0.79"
0.79"
-
Technical Docs (1)
Associated Products
4 Products Found
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Great Britain
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate