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Evaluation Kit, PAN1326C Host Controlled Interface (HCI) Bluetooth RF Module, Bluetooth 4.2


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ENW89819AYKF   Datasheet
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Product Overview

Panasonic's new PAN1326C Host Controlled Interface (HCI) Bluetooth RF module brings Texas Instrument's seventh generation Bluetooth core integrated circuit, the CC2564, to an easy to use module format. PAN1326C is Bluetooth 4.2 compliant and of- fers best-in-class RF performance with about twice the range of other Bluetooth low-energy solutions. Using Panasonic's tiny footprint technology the module only is 85.5mm². The module is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing. This module has been designed to be 100% pin compatible with previous generation of Texas Instruments based Bluetooth HCI modules.
  • Bluetooth-4.2-compliant up to the HCI layer
  • Dimensions is 9.0mm x 9.5mm x 1.8mm
  • Based upon TI's CC2564C
  • Interfaces: UART, GPIO, PCM
  • Scatternet: up to three piconets simultaneously
  • Output power 12 dBm
  • Sleep mode 135 µA
  • Operating temperature range -45 ºC to +85 ºC
  • Receiver sensitivity -93 dBm

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Wireless Connectivity

Bluetooth Classic & Low Energy

PAN1326C Daughterboard, Texas Instruments Development Board for PAN1326C, Adapter Board, Launch Pad


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Available to manufacturer lead time of 124 days


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