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VD90.5009

Solder Pellets, for BGA Reballing, 0.5 mm, 183 °C, 27 g

MARTIN SMT VD90.5009

Image is for illustrative purposes only. Please refer to product description.

Manufacturer Part No:
VD90.5009
Order Code:
2352926
Technical Datasheet:
VD90.5009   Datasheet
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Product Information

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:
63, 37 Sn, Pb

:
183°C

:
0.5mm

:
27g

:
0.952oz

:
-

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Technical Docs (4)

CAD Downloads

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Terms and Conditions

CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Product Overview

The VD90.5009 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It's material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good.
  • ±10µm tolerance
  • 99.9% purity

Applications

Maintenance & Repair, Industrial

5 In stock

3 more will be available on 6/20/21

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€172.57

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