DOW SE4420

The SE4420 is a Thermally Conductive Adhesive designed to provide efficient thermal transfer for the cooling of electronic modules, including telecom and power supply devices. One-part RTV-cure thermally conductive materials cure with moisture exposure to produce durable, relatively low-stress elastomer with a noncorrosive by-product. Electronic devices are continually designed to deliver higher performance. It is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal bridge to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).